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At present positionCapability

Type

Description

Process Capabilities

File format

Gerber-optimal format

274-X, DPF

Drill file

Corresponding X,Y locations and hold diameters

Dimensions

Max. dimensions of product

533.4mm x 609.6mm - Single / Double-Side PCB

533.4mm x 609.6mm - Multi-layer PCBs

PCB Thickness

Standard PCB Thickness

1.6mm +/- 10% (0.062" +/- 10%)

Min. thickness

Single/double-side PCB: 0.2mm +/- 0.1mm (0.008" +/- 0.004")

  4-layer PCB: 0.4mm +/- 0.1mm (0.016" +/- 0.004")

  6-layer PCB: 0.6mm +/- 0.1mm (0.024" +/- 0.004")

  8-layer PCB: 0.9mm +/- 0.1mm (0.036" +/- 0.004")

10-layer PCB: 1.0mm +/- 0.12mm (0.04" +/- 0.005")

12-layer PCB: 1.2mm +/- 0.12mm (0.048" +/- 0.005")

Max. thickness

5.0mm +/- 10%
(0.236" +/- 10% )

Warp of PCB

< 7/1000

Board meaterial

FR-4、High TG FR-4 (170℃/180℃)、ISOLA(FR-408、FR-408HR)、ROGERS、Halogen free

FR4 Thickness (standard)

1.6mm (0.062")

        High TG FR4 (170 deg C) (standard)

1.6mm (0.062")

Metal board

Aluminum substrate,copper substrate

Cutting

Max. number of layers

36 layers

Min. thickness of inner layers(excluding copper thickness)

0.0508mm (0.002")

Drills

Minimum size

0.1mm (0.004")laser drill,0.15mm(0.006)mechanical drill

Maximum size

6.35mm

Drill hole deviation

+/- 0.002" (0.050mm)

PTH diameter tolerance

+/- 0.003" (0.075mm)

Non-PTH diameter tolerance

+/- 0.002" (0.050mm)

Annual ring isolation

+/- 0.005" (0.127mm)

Copper plating

Min. hole copper

0.0008"

Aspect ratio

12/1

Etching

Trace width tolerance

+/- 20% (impedance control +/- 1mil)

Min. trace width/spacing(1oz)copper base 1/3oz

0.003"/ 0.003" (0.1mm)

Min. trace width/spacing(1oz)copper base 1/2oz

0.004"/ 0.004" (0.1016mm)

Min. trace width/spacing(2oz)

0.007"/ 0.007" (0.18mm)

Min. trace width/spacing(3oz)

0.010"/ 0.010" (0.254mm)

Min. trace width/spacing(4oz)

0.013"/ 0.013" (0.3302mm)

Inner layer

MIn. clearance between hole and inner trace

0.006"(0.15mm)

Min. inner hole isolatioin ring

0.006"(0.15mm)

Inter-layer Reqistration

+/- 0.003"(0.08mm)

Solder Mask

Color

Green, Light gree, matt green, white, black, yellow, red, blue, clear

Min. space beweent solder mask to make dams

0.003"

Thickness of solder mask

0.001"

Silkscreen

Color

White, black, yellow, red, blue, green

Min. line width

0.004"

Min. height/width

0.024" / 0.032"

Electro tests

AOI Test

Yes

Flying probe test

Yes

Impedance control

Tolerance

+/- 10%

Impedance tester

POLAR CITS800S4

CNC Routing

Form and hole expansion

+/- 0.15mm (0.006")

CNC tolerance

+/- 0.15mm (0.006")

V-Cut depth (board th. > =1.0mm )

+/- 0.1mm (0.004")

V-Cut deviation

+/- 0.1mm (0.004")

SEMI HOLE

Yes

Surface treatment

       HASL/ Lead-free HASL/ Immersion gold/ Immersion Silver/ Immersion tin/ OSP/ Full body gold plating/ Gold finger plating/ Carbon ink, selective gold or plating gold

Blind buried hole

2+N+2

Yes

Via in Pad

Yes

Other

UL Certificate

UL NO.E206991

Quality Certificate

ISO9001:2000

 

 

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