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Type
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Description
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Process Capabilities
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File format
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Gerber-optimal format
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274-X, DPF
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Drill file
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Corresponding X,Y locations and hold diameters
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Dimensions
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Max. dimensions of product
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533.4mm x 609.6mm - Single / Double-Side PCB
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533.4mm x 609.6mm - Multi-layer PCBs
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PCB Thickness
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Standard PCB Thickness
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1.6mm +/- 10% (0.062" +/- 10%)
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Min. thickness
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Single/double-side PCB: 0.2mm +/- 0.1mm (0.008" +/- 0.004")
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4-layer PCB: 0.4mm +/- 0.1mm (0.016" +/- 0.004")
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6-layer PCB: 0.6mm +/- 0.1mm (0.024" +/- 0.004")
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8-layer PCB: 0.9mm +/- 0.1mm (0.036" +/- 0.004")
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10-layer PCB: 1.0mm +/- 0.12mm (0.04" +/- 0.005")
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12-layer PCB: 1.2mm +/- 0.12mm (0.048" +/- 0.005")
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Max. thickness
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5.0mm +/- 10% (0.236" +/- 10% )
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Warp of PCB
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< 7/1000
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Board meaterial
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FR-4、High TG FR-4 (170℃/180℃)、ISOLA(FR-408、FR-408HR)、ROGERS、Halogen free
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FR4 Thickness (standard)
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1.6mm (0.062")
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High TG FR4 (170 deg C) (standard)
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1.6mm (0.062")
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Metal board
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Aluminum substrate,copper substrate
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Cutting
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Max. number of layers
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36 layers
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Min. thickness of inner layers(excluding copper thickness)
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0.0508mm (0.002")
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Drills
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Minimum size
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0.1mm (0.004")laser drill,0.15mm(0.006)mechanical drill
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Maximum size
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6.35mm
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Drill hole deviation
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+/- 0.002" (0.050mm)
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PTH diameter tolerance
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+/- 0.003" (0.075mm)
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Non-PTH diameter tolerance
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+/- 0.002" (0.050mm)
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Annual ring isolation
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+/- 0.005" (0.127mm)
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Copper plating
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Min. hole copper
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0.0008"
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Aspect ratio
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12/1
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Etching
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Trace width tolerance
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+/- 20% (impedance control +/- 1mil)
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Min. trace width/spacing(1oz)copper base 1/3oz
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0.003"/ 0.003" (0.1mm)
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Min. trace width/spacing(1oz)copper base 1/2oz
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0.004"/ 0.004" (0.1016mm)
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Min. trace width/spacing(2oz)
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0.007"/ 0.007" (0.18mm)
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Min. trace width/spacing(3oz)
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0.010"/ 0.010" (0.254mm)
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Min. trace width/spacing(4oz)
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0.013"/ 0.013" (0.3302mm)
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Inner layer
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MIn. clearance between hole and inner trace
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0.006"(0.15mm)
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Min. inner hole isolatioin ring
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0.006"(0.15mm)
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Inter-layer Reqistration
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+/- 0.003"(0.08mm)
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Solder Mask
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Color
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Green, Light gree, matt green, white, black, yellow, red, blue, clear
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Min. space beweent solder mask to make dams
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0.003"
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Thickness of solder mask
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0.001"
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Silkscreen
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Color
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White, black, yellow, red, blue, green
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Min. line width
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0.004"
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Min. height/width
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0.024" / 0.032"
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Electro tests
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AOI Test
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Yes
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Flying probe test
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Yes
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Impedance control
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Tolerance
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+/- 10%
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Impedance tester
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POLAR CITS800S4
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CNC Routing
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Form and hole expansion
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+/- 0.15mm (0.006")
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CNC tolerance
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+/- 0.15mm (0.006")
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V-Cut depth (board th. > =1.0mm )
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+/- 0.1mm (0.004")
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V-Cut deviation
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+/- 0.1mm (0.004")
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SEMI HOLE
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Yes
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Surface treatment
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HASL/ Lead-free HASL/ Immersion gold/ Immersion Silver/ Immersion tin/ OSP/ Full body gold plating/ Gold finger plating/ Carbon ink, selective gold or plating gold
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Blind buried hole
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2+N+2
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Yes
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Via in Pad
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Yes
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Other
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UL Certificate
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UL NO.E206991
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Quality Certificate
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ISO9001:2000
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